Method of manufacturing vehicle electric power distribution system
AssigneeCooper Technologies Company
InventorJacek M. Korczynski
Life of this patent
Estimating the term…
Abstract
A method of assembling a power distribution apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by removable connecting links. The method includes selectively removing a portion of the connecting links on each conductive circuit plate to form discrete circuits on the conductive plates, stacking the conductive plates, mounting contact pins to selected contact pads, and heating the stacked plates and the mounted contact pins, thereby reflowing the conductive circuit plates and the pins to create solder joints therebetween.
Claims18
A method of assembling a power distribution apparatus, the apparatus including a plurality of conductive circuit plates, each conductive plate including a plurality of contact pads that are interconnected by removable connecting links, said method comprising:
- selectively removing a portion of the connecting links to terminate a current path or remove the connection of the path on each conductive circuit plate to form discrete circuits on the conductive plates;
- stacking the conductive plates;
- mounting contact pins to selected contact pads;
- and
- heating the stacked plates and the mounted contact pins, thereby reflowing the conductive circuit plates and the pins to create solder joints therebetween.
A method of fabricating a power distribution apparatus, the apparatus including a plurality of conductive circuit plates, each conductive circuit plate including a substrate and a reflowable material thereupon, each conductive circuit plate including a plurality of contact pads that are interconnected by removable connecting links, said method comprising:
- selectively removing a portion of the connecting links on each conductive circuit plate to form discrete circuits on the conductive plates;
- assembling the conductive circuit plates;
- mounting a plurality of contact pins to selected contact pads of selected conductive circuit plates, at least some of the contact pins including a substrate and a reflow material thereupon;
- and
- reflowing the reflowable material of the circuit plates and the conductive pins.
A method of fabricating a power distribution, apparatus comprising:
- forming a plurality of conductive circuit plates, each conductive circuit plate including a substrate and a reflowable material thereupon, each conductive circuit plate including a plurality of contact pads that are interconnected by removable connecting links;
- forming a nonconductive layer over the conductive circuit plates;
- selectively removing a portion of the connecting links on each conductive circuit plate to form discrete circuits on the conductive plates;
- stacking the conductive circuit plates;
- mounting a plurality of contact pins to selected contact pads of selected conductive circuit plates, at least some of the contact pins including a substrate and a reflowable material thereupon;
- and
- reflowing the reflowable material of the conductive circuit plates and the conductive pins.
A method of fabricating a power distribution apparatus comprising:
- forming a plurality of conductive circuit layers, each conductive circuit layers plated with a reflowable material, each conductive circuit layer including a plurality of contact pads that are interconnected by removable connecting links;
- overmolding a nonconductive layer over said conductive circuit layers after said circuit layers are formed;
- selectively removing a portion of the connecting links on each conductive circuit layer to form discrete circuits on the conductive circuit layers;
- assembling the conductive plates;
- mounting a plurality of contact pins to selected contact pads of selected circuit layers, at least some of the contact pins plated with a reflowable material;
- and
- reflowing the reflowable material of the circuit plates and the conductive pins.
A method of fabricating a power distribution apparatus comprising:
- stamping a plurality of conductive circuit layers from a sheet of conductive material plated with a reflowable material, each conductive circuit layer including a plurality of contact pads that are interconnected by removable connecting links;
- overmolding a nonconductive layer over each of said conductive circuit layers after the circuit layers are formed;
- selectively shearing a portion of the connecting links on each conductive circuit layer after overmolding the conductive circuit layers, thereby forming discrete circuits on the conductive circuit layers;
- stacking the conductive plates;
- mounting a plurality of contact pins to selected contact pads of selected circuit layers, at least some of the contact pins plated with a reflowable material;
- and
- reflowing the reflowable material of the circuit plates and the conductive pins at a temperature below a melting point of the nonconductive layer.
Dependencies are inferred from the claim text.