Active matrix substrate, method of manufacturing the same, and display device

An active matrix substrate comprising:

• a substrate;
• a plurality of first thin-film interconnection lines provided substantially in parallel with a first direction on the substrate;
• a plurality of thin-film active elements provided on the substrate, each of the plurality of thin-film active elements being connected to one of the plurality of first thin-film interconnection lines;
• a plurality of first thick-film adhesive pads made of organic resin provided between each of the plurality of first thin-film interconnection lines and the substrate;
• and
• a plurality of second thick-film adhesive pads made of organic resin, provided between each of the plurality of thin-film active elements and the substrate and formed integrally with any one of the first thick-film adhesive pads.

An active matrix substrate manufacturing method comprising:

• forming a plurality of thin-film active elements on a first substrate;
• transferring the plurality of thin-film active elements onto a second substrate;
• forming a plurality of thick-film adhesive pads made of organic resin on a third substrate, so as to have, at least at a part of a side face thereof, an inclined region having a contact angle smaller than 90 degrees to a main face of the third substrate;
• transferring part of the plurality of thin-film active elements on the second substrate onto the third substrate by causing the part of the plurality of thin-film active elements to adhere to the individual ones of the plurality of thick-film adhesive pads;
• and
• forming interconnection lines extending from the thin-film active elements on the third substrate onto the third substrate via the inclined regions.

An active matrix substrate manufacturing method comprising:

• forming a plurality of thin-film active elements on a first substrate;
• transferring the plurality of thin-film active elements onto a second substrate;
• forming a plurality of thick-film adhesive pads made of organic resin on a third substrate;
• applying a stress to shift the second substrate and the third substrate relatively in opposite directions, with part of the plurality of thin-film active elements transferred onto the second substrate in contact with the individual ones of the plurality of thick-film adhesive pads, thereby not only causing the thin-film active elements to adhere to the thick-film adhesive pads for transfer but also forming an inclined region having a first contact angle smaller than 90 degrees to a main face of the third substrate at one side face of each of the plurality of thick-film adhesive pads;
• and
• forming interconnection lines extending from the plurality of thin-film active elements on the third substrate onto the third substrate via the inclined regions.