Package with a substrate of high thermal conductivity
AssigneePlansee SE
InventorsArndt Ludtke, Heiko Wildner
Life of this patent
Estimating the term…
Abstract
A package is configured as a composite component with a substrate, at least one semiconductor component, and an enclosure, which are joined to one another. The heat-dissipating substrate is a single-layer or multilayer substrate with a thermal conductivity, transversely with respect to a joining surface to which the semiconductor component is joined, of greater than 170 W/m. The substrate may be a layered structure and/or a structure of graduated material composition, and it has an asymmetrical thermal expansion characteristic. By suitable selection the layers or the material graduation, it is possible to reduce and limit the shear distortion of the composite component formed of the substrate, the semiconductor component, and the enclosure.
Claims14
A composite component package, comprising:
- a substrate having a base surface and a joining surface opposite said base surface;
- at least one semiconductor component joined to said joining surface of said substrate;
- and
- an enclosure joined to said substrate;
- said substrate having a thermal conductivity, transversely to said joining surface, of greater than 170 W/mK;
- and
- said substrate having an asymmetrical thermal expansion with a coefficient of thermal expansion of said joining surface differing from a coefficient of thermal expansion of said base surface by at least 2%.
A method of producing a composite component package, which comprises:
- forming a heat-dissipating substrate having mutually opposite base and joining surfaces and a thermal conductivity perpendicular to the joining surface of greater than 170 W/mK;
- producing the substrate with an asymmetrical thermal expansion with a coefficient of thermal expansion of the joining surface and a coefficient of thermal expansion of the base surface differing by at least 2%;
- and
- joining a semiconductor component to the joining surface of the substrate and joining an enclosure to the substrate.
Dependencies are inferred from the claim text.