Process for producing precision metal components

A process for producing a precision metal component with perforated parts comprising the steps of

• providing a metal plate having a plurality of layers in the order of copper, nickel, copper, nickel and copper in cross-section from one surface to the other, said copper layers on both the surfaces being much thinner than other layers, adhering a resist on both the surfaces of said metal plate,
• placing a glass or film patterned masks on both the surfaces and exposing it to light, said patterned masks having respective generally symmetrically corresponding patterns and being aligned each other,
• removing parts of the resist corresponding to said patterns to make both the surfaces of said metal plate to have metal exposed parts,
• etching, at said metal exposed parts, said thin copper layers on the surfaces and said nickel layers below them with a first etching solution,
• etching said copper layer which has been exposed below said nickel layer etched in the previous step with a second etching solution to form perforated parts in said metal plate having a plurality of layers, and
• removing the remaining resist.

In a process of producing a precision metal component comprising the steps of

• adhering a resist on the surface of a material in a predetermined precision pattern using photographic technique,
• either plating the material with a metal so that the metal is added on the exposed parts of the material or etching the material so that a metal is removed from the material, and
• removing the resist,
• the method characterized in that said material has, on a non-copper material, at least a thin copper layer as a surface on which the resist is adhered.

In a process of producing a precision metal component having a metal surface of a predetermined pattern, comprising the steps of

• adhering a resist on the surface of a material in a predetermined precision pattern by exposing the surface to light in the predetermined pattern using photographic technique to remove light-unexposed parts of the resist to form exposed surface parts on which there is no resist,
• plating the material with a metal so that the metal is added on the exposed parts of the material to form metal-plated parts on said material, and
• removing the resist,
• the process being characterized in that said material has, on a non-copper material, at least a thin copper layer as a surface on which the resist is adhered, and further characterized in that said material has at least a copper layer as a surface on which the resist is adhered, said copper layer being in intimate contact with a plate of glass/epoxy or alumina/epoxy composite material, and that said metal for plating on said copper layer is other than copper.