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US 2003/0224104 A1Published application
Solution containing metal component, method of and apparatus for forming thin metal film
AssigneeEBARA CORPORATION, Tokyo, Japan
InventorsAkira Fukunaga, Hiroshi Nagasawa, Takao Kato
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Abstract
A solution containing a metal component comprises composite ultrafine metal particles each having a core substantially made of a metal component and a covering layer made of an organic compound chemically bonded to the core. The core has an average diameter ranging from 1 to 10 nm. The composite ultrafine metal particles are uniformly dispersed in a solvent.
Claims16
A method of forming a thin metal film on a surface of a substrate, comprising:
- preparing a metal film precursor containing ultrafine metal particles,
- placing the metal film precursor on a film made of organic material to produce a transfer sheet,
- contacting a surface of a substrate to the metal film precursor on the film;
- and
- heating the transfer sheet at a temperature to decompose the film and the metal film precursor so that said ultrafine metal particles join together to form a thin metal film on the surface of the substrate.
2 more elements
A method of forming a thin metal film on a surface of a substrate, comprising:
- preparing a metal film precursor containing ultrafine metal particles,
- placing the metal film precursor on a film to produce a transfer sheet,
- contacting a surface of a substrate to the metal film precursor on the film;
- peeling off the film to leave the metal film precursor on the surface of the substrate, and
- heating the metal film precursor at a temperature to decompose the metal film precursor so that said ultrafine metal particles join together to form a thin metal film on the surface of the substrate.
2 more elements
Dependencies are inferred from the claim text.