Semiconductor device having semiconductor memory
AssigneeOki Electric Industry Co., Ltd.
InventorMasayuki Otsuka
Life of this patent
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Abstract
A semiconductor device includes first and second semiconductor chips encapsulated in a package. The first semiconductor chip includes a semiconductor memory having a general source pad and a word line-dedicated source pad. The second semiconductor chip has a step-down circuit for supplying a first potential to the general source pad of the first semiconductor chip. The step-down circuit supplies a second potential higher than the first potential to the word line-dedicated source pad of the first semiconductor chip.
Claims20
A semiconductor device, comprising:
- a first semiconductor chip including a semiconductor memory having a general source pad and a word line-dedicated source pad;
- and
- a second semiconductor chip having a step-down circuit for supplying a first potential to the general source pad of the first semiconductor chip, the step-down circuit supplying a second potential higher than the first potential to the word line-dedicated source pad of the first semiconductor chip,
- wherein the first and second semiconductor chips are encapsulated in a package.
A semiconductor device, comprising:
- a semiconductor memory chip-having a general source pad and a word line-dedicated source pad, the semiconductor memory chip includes a word line driver connected to the word line-dedicated source pad;
- and
- a semiconductor custom chip mounted on the semiconductor memory chip, the semiconductor custom chip having a step-down circuit for supplying a first potential to the general source pad of the first semiconductor chip, the step-down circuit supplying a second potential higher than the first potential to the word line-dedicated source pad of the first semiconductor chip.
A semiconductor device, comprising:
- a semiconductor memory chip having a general source pad applied to a first potential and a word line-dedicated source pad applied to a second potential that is higher than the first potential, the semiconductor memory chip includes a plurality of word lines driven by the second potential and a plurality of circuits driven by the first potential;
- and
- a semiconductor custom chip mounted on the semiconductor memory chip, the semiconductor custom chip having a step-down circuit for supplying the first potential to the general source pad of the first semiconductor chip and the second potential to the word line-dedicated source pad of the first semiconductor chip.
Dependencies are inferred from the claim text.