Method of mounting a butterfly package on a PCB
AssigneeMeriton Networks Inc.
InventorsEric Lutkiewicz, Bob Van Leeuwen, Peter J. KleinBeernink
Life of this patent
Estimating the term…
Abstract
A method of mounting a package such as a Butterfly package to a printed circuit board in order to make efficient use of the board's real estate is described. According to a preferred embodiment of the invention the package is mounted on its side such that leads of one side (now the bottom) of the butterfly package are connected either directly to surface mount pads on the PCB or project through and connected to through-holes in the PCB. The leads on the other side (now top) are connected to a flex circuit or ribbon cable. A heatsink can be attached to the package without impinging significantly on the PCB layout.
Claims17
A method of mounting a package to a printed circuit board (PCB), the package having a body with a plurality of leads extending outwardly from opposed first and second sides of the body, the method comprising:
- locating the package on the PCB such that leads on the first side of the body are directed toward the PCB;
- connecting the leads on the first side to connection points on the PCB;
- and
- connecting the leads on the second side of the body to a flexible ribbon connector.
A method of mounting butterfly packages each having a body and multiple leads extending outwardly from opposite sides thereof, on a printed circuit board (PCB) to increase component density, the method comprising:
- securing the butterfly package on a primary side of the PCB on which conducting paths have been formed on at least one of the primary, secondary or internal layers;
- attaching flexible connectors to the leads on the opposite side of the butterfly package;
- and
- connecting the flexible connectors to second contact points on the PCB.
Dependencies are inferred from the claim text.