Hole fill composition and method for filling holes in a substrate
AssigneeInternational Business Machines Corporation
InventorsDonald S. Farquhar, Konstantinos I. Papathomas
Life of this patent
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Abstract
A composition usable in hole filling of a metal layer and to planarize the metal layer is provided. The metal layer is part of a substrate which can be part of a multilayer printed circuit board or chip carrier. The composition comprises a fluoropolymer dielectric metal, a filler material, and a coupling agent, the filler material having at least a partial coating of the coupling agent.
Claims28
A hole fill composition comprising:
- a fluoropolymer dielectric material;
- a filler material;
- and
- a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.
A hole fill composition comprising:
- a fluoropolymer dielectric material;
- a surfactant;
- a filler material;
- and
- a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.
A hole fill composition comprising:
- a fluoropolymer dielectric material;
- a silica filler material;
- and
- a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.
A hole fill composition comprising:
- a fluoropolymer dielectric material;
- a surfactant;
- a silica filler material;
- and
- a coupling agent, said filler material having at least a partial coating of said coupling agent thereon.
A hole fill composition comprising:
- a fluoropolymer dielectric material;
- a filler material;
- and
- a fluorosilane coupling agent, said filler material having at least a partial coating of said coupling agent thereon.
A hole fill composition comprising:
- a fluoropolymer dielectric material;
- a surfactant;
- a filler material;
- and
- a fluorosilane coupling agent, said filler material having at least a partial coating of said coupling agent thereon.
Dependencies are inferred from the claim text.