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AssigneeSpeedFam-IPEC Corporation
InventorsNikolay Korovin, Stephen C. Schultz
Estimating the term…
Layers of material deposited exhibit both a local and a global pattern. The local pattern is a function of the underlying wafer surface, but the global pattern is a function of the equipment in which the layer was deposited. Accurate reconstruction of the surface topology of a layer on a product wafer is achieved despite the local pattern by determining the surface topology of a blanket layer on a blank wafer, measuring the thickness of the layer at a few selected locations on a product wafer, calculating scaling coefficients representing deviations of the measured thickness from the blanket layer topology, and then multiplying the blanket layer topology by the scaling coefficients. The surface reconstruction results from modifying the surface topology of the blanket layer so that it has the same thickness at the measured locations as does the product wafer layer.
A method for reconstructing the surface topology of a product work piece having a layer deposited thereon by a deposition apparatus, the method comprising the steps of:
A method for reconstructing the topology of the surface of a deposited layer on the surface of a work piece comprising the steps of:
A method for processing a work piece having a layer of material deposited thereon in a multi-zonal processing apparatus comprising the steps of:
Dependencies are inferred from the claim text.