Method for forming wiring structure
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTakeshi Harada, Hideaki Yoshida, Tetsuya Ueda, Masashi Hamanaka
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Abstract
After a plurality of grooves are formed in an insulating film, a barrier metal film and a conductive film are deposited successively on the insulating film such that each of the grooves is filled completely therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, a foreign matter adhered to the surface to be polished during polishing is removed and then a surface of the insulating film is polished.
Claims24
A method for forming a wiring structure, the method comprising:
- a groove forming step of forming, in an insulating film, a first groove and a second groove adjacent to the first groove;
- a film depositing step of depositing a barrier metal film and a conductive film on the insulating film such that each of the first and second grooves is filled therewith;
- a first polishing step of removing the portion of the conductive film outside the first and second grooves by polishing;
- a second polishing step of removing, after the first polishing step, the portion of the barrier metal film outside the first and second grooves by polishing;
- a foreign matter removing step of removing a foreign matter adhered to a surface to be polished after the second polishing step therefrom;
- and
- a third polishing step of polishing, after the foreign matter removing step, a surface of the insulating film.
Dependencies are inferred from the claim text.