Method for forming wiring structure

A method for forming a wiring structure, the method comprising:

• a groove forming step of forming an anti-reflection film on an insulating film and then forming, in each of the anti-reflection film and the insulating film, a first groove and a second groove adjacent to the first groove;
• a film depositing step of depositing a barrier metal film and a conductive film on the anti-reflection film such that each of the first and second grooves is filled therewith;
• a first polishing step of removing the portion of the conductive film outside the first and second grooves by polishing;
• a second polishing step of removing, after the first polishing step, the portion of the barrier metal film outside the first and second grooves by polishing;
• a foreign matter removing step of removing a foreign matter adhered to a surface to be polished after the second polishing step therefrom;
• and
• a third polishing step of polishing, after the foreign matter removing step, a surface of the anti-reflection film by using an abrasive agent of the same type as used in the first polishing step.