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US 2003/0216010 A1Published application
Forming a multi segment integrated circuit with isolated substrates
AssigneeImagerlabs, Inc.
InventorEugene Atlas
Life of this patent
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Abstract
Methods of forming a multi-segment chip or integrated circuit device are provided. The multi-segment chip may comprise at least two blocks, such as an analog integrated circuit block and a digital integrated circuit block, with substrates that are isolated from each other. Thus, each block may have independent operation voltage or other characteristics.
Claims45
A method of forming a multi-segment chip, the method comprising:
- forming first and second connects on a first planar surface of a substrate, the substrate comprising first and second integrated circuit dies, the first integrated circuit die comprising at least first and second sub-dies, the first connect interconnecting the first and second sub-dies, the second connect at least partially overlaying the first and second integrated circuit dies
- attaching a first insulating layer to the first planar surface of the substrate;
- scribing a second planar surface of the substrate to form (a) a scribed channel between the first and second integrated circuit dies and (b) an isolation channel between the first and second sub-dies;
- etching the scribed channel and the isolation channel;
- and
- attaching a second insulating layer to the second planar surface of the substrate.
3 more elements
An integrated circuit device comprising:
- a first sub-die having a first integrated circuit;
- a second sub-die having a second integrated circuit, the first integrated circuit being isolated from the second integrated circuit;
- a connect in contact with the first and second sub-dies;
- a first protective layer and a first epoxy layer proximate to a first surface of the first and second sub-dies;
- and
- a second protective layer proximate to a second surface of the first and second sub-dies.
3 more elements
Dependencies are inferred from the claim text.