Solid-state imaging device and manufacturing method for solid-state imaging device
AssigneeFuji Photo Film Co., Ltd.
InventorMakoto Shizukuishi
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Abstract
A solid-state imaging device, comprises: a semi-conductor substrate demarcating a two-dimensional surface; a multiplicity of photoelectric conversion units formed being arranged in a plurality of rows and columns on the semiconductor substrate; a planarizing insulating film formed above the semiconductor substrate; and a plurality of gap-less microlenses having spectral characters, each gap-less microlens being formed above each of the photoelectric conversion units with the planarizing insulating film placed in-between.
Claims21
A solid-state imaging device, comprising:
- a semi-conductor substrate demarcating a two-dimensional surface;
- a multiplicity of photoelectric conversion units formed being arranged in a plurality of rows and columns on the semiconductor substrate;
- a planarizing insulating film formed above the semiconductor substrate;
- and
- a plurality of gap-less microlenses having spectral characters, each gap-less microlens being formed above each of the photoelectric conversion units with the planarizing insulating film placed in-between.
A solid-state imaging device, comprising:
- a semi-conductor substrate demarcating a two-dimensional surface;
- a multiplicity of photoelectric conversion units formed being arranged in a plurality of rows and columns on the semiconductor substrate;
- a planarizing insulating film formed above the semiconductor substrate;
- a plurality of inner-lenses having spectral characters, each inner-lens corresponding to each of the photoelectric conversion units;
- and
- a plurality of gap-less microlenses made of a transparent resist, each gap-less microlens being formed above each of the photoelectric conversion units with the planarizing insulating film and the inner lenses placed in-between.
A manufacturing method of a solid-state imaging device, comprising the steps of:
- (a) preparing a semi-conductor substrate demarcating a two-dimensional surface;
- (b) forming a multiplicity of photoelectric conversion units arranged in a plurality of rows and columns on the semiconductor substrate;
- (c) forming a planarizing insulating film above the semiconductor substrate;
- and
- (d) forming a plurality of gap-less microlenses having spectral characters, each gap-less microlens being formed above each of the photoelectric conversion units with the planarizing insulating film placed in-between.
Dependencies are inferred from the claim text.