Resin composition for sealant, laminate, and container obtained therefrom
AssigneeMitsui Chemicals, Inc.
InventorsNorihide Inoue, Takashi Kimura
Life of this patent
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AssigneeMitsui Chemicals, Inc.
InventorsNorihide Inoue, Takashi Kimura
Estimating the term…
A resin composition (a) for a sealant comprising 10 to 70% by weight of an ethylene polymer (A-a) having a density of 0.900 to 0.960 g/cm3 and MFR(190° C.) of 1 to 70 g/10 min, 10 to 80% by weight of a propylene polymer (B-a) and 10 to 70% by weight of a butene polymer (C-a), and a resin composition (b) for a sealant comprising 10 to 70% by weight of an ethylene/α-olefin copolymer (A-b) having a density of 0.850 to 0.900 g/cm3 and a melt flow rate (MFR-A), as measured at 190° C., of 0.1 to 10 g/10 min, 10 to 80% by weight of a propylene polymer (B-b) having a melt flow rate (MFR-B), as measured at 230° C., of 0.5 to 100 g/10 min and a ratio of MFR-B to MFR-A (MFR-B/MFR-A) of 3 or more and 0 to 50% by weight of an ethylene polymer (C-b) having a density of 0.900 to 0.960 g/cm3 are disclosed. Also disclosed are a laminate obtained using the resin composition and a container obtained from the laminate. By the use of the resin composition for a sealant, a laminate having both of sealing properties and heat-sealing properties can be produced, and from the laminate, an easy peel container can be produced. The container has an excellent balance between the sealing properties and the easy peel properties, and is favorable as a food-packaging container.
A resin composition for a sealant, comprising:
A resin composition for a sealant, comprising:
Dependencies are inferred from the claim text.