Fine patterning and fine solid via process for multi-layer substrate

Abstract

A fine patterning and fine solid via process with printing method for multi-layer substrate, which including the following steps, providing a substrate which is completed from the pre-process; placing a dielectric layer on at least one surface of the substrate; defining via and circuit on the dielectric layer with the laser ablation; printing the surface of the dielectric layer with sub-micro conductive paste and stuffing said via and circuit on the dielectric layer to form complete via and circuit structure. Finally, proceeding the planarization process on the conductive paste placed on the surface of the substrate to form the complete conductive circuit and via structure at the same time.

Dependencies are inferred from the claim text.