Heat dissipating flip-chip ball grid array
AssigneeTexas Instruments Incorporated
InventorsEdgardo R. Hortaleza, Orlando F. Torres
Life of this patent
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Abstract
The present invention discloses a heat dissipating flip-chip Ball Grid Array (BGA) (10). In one embodiment, the flip-chip BGA comprises a substrate (12), a die (14), a first set of solder balls (16) adapted to couple the die with the substrate, a thermal compound (20) adapted to couple to a backside of the die, a second set of solder balls (28) adapted to couple with the substrate, and a printed circuit board (22) comprising a heat dissipating metal (24), wherein the heat dissipating metal is adapted to couple with the thermal compound, and wherein the second set of solder balls is adapted to couple with the printed circuit board.
Claims34
A flip-chip ball grid array, comprising:
- a substrate;
- a die;
- a first set of solder balls adapted to couple the die and the substrate;
- a thermal compound adapted to couple with a backside of the die;
- a second set of solder balls adapted to couple with the substrate;
- and
- a printed circuit board comprising a heat dissipating metal, wherein the heat dissipating metal is adapted to couple with the thermal compound, and wherein the second set of solder balls is adapted to couple with the printed circuit board.
A flip-chip ball grid array, comprising:
- a substrate;
- a die comprising a plated backside;
- a plurality of solder bumps adapted to couple the die and the substrate;
- a heat dissipating metal adapted to couple with the plated backside of the die;
- a plurality of solder balls adapted to couple with the substrate;
- and
- a multi-layer printed circuit board adapted to couple with the heat dissipating metal and with the plurality of solder balls.
A flip-chip ball grid array, comprising:
- a substrate;
- a die;
- a first set of solder balls adapted to couple the die and the substrate;
- a thermal compound adapted to couple with a backside of the die;
- a second set of solder balls adapted to couple with the substrate;
- and
- a multi-layer printed circuit board comprising:
- a heat dissipating metal, comprising thermal vias, adapted to couple with the thermal compound;
- and
- thermal vias adapted to couple with the second set of solder balls.
A method for producing a flip-chip ball grid array, comprising:
- coupling a die and a first set of solder balls;
- coupling a substrate and the first set of solder balls;
- coupling a thermal compound and a backside of the die;
- coupling a second set of solder balls and the substrate;
- coupling a heat dissipating metal on a printed circuit board and the thermal compound;
- and
- coupling the second set of solder balls and the printed circuit board.
A method for producing a flip-chip ball grid array, comprising:
- coupling a die and a plurality of solder bumps;
- coupling a substrate and the plurality of solder bumps;
- coupling a plated backside of the die and a heat dissipating metal;
- coupling a plurality of solder balls and the substrate;
- coupling a multi-layer printed circuit board and the heat dissipating metal;
- and
- coupling the multi-layer printed circuit board and the plurality of solder balls.
A method for producing a flip-chip ball grid array, comprising:
- coupling a die and a first set of solder balls;
- coupling a substrate and the first set of solder balls;
- coupling a thermal compound and a backside of the die;
- coupling a second set of solder balls and the substrate;
- coupling a multi-layer printed circuit board heat dissipating metal and the thermal compound;
- and
- coupling thermal vias, of the multi-layer printed circuit board, and the second set of solder balls.
Dependencies are inferred from the claim text.