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US 2003/0214035 A1Published application
Bump formed on semiconductor device chip and method for manufacturing the bump
AssigneeSamsung Electronics Co., Ltd.
InventorsYong-Hwan Kwon, Sa-Yoon Kang
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Abstract
A bump of a semiconductor chip comprises a plurality of bond pads formed on a semiconductor chip, a conductive bump formed on the bond pads; and a sidewall insulating layer formed on sidewalls of the conductive bump. It is possible for the semiconductor chip to prevent electrical shorts and improve productivity even though a pitch of bond pad is decreased.
Claims27
A bump of a semiconductor chip, comprising:
- a plurality of bond pads formed on a semiconductor chip;
- a conductive bump formed on the bond pads;
- and
- a sidewall insulating layer formed on sidewalls of the conductive bump.
1 more element
A method for manufacturing a semiconductor chip, the method comprising;
- forming an insulating layer on a semiconductor chip having a plurality of bond pads formed thereon;
- forming a contact hole in the insulating layer to expose the bond pads;
- forming a bump conductive layer in the contact hole;
- and
- forming a sidewall insulating layer on sidewalls of the bump conductive layer by removing a portion of the insulating layer.
2 more elements
A chip-on-glass (COG) package comprising;
- a package substrate having a plurality of connection pads;
- a semiconductor chip comprising a plurality of bond pads arranged to face the plurality of connection pads and to be electrically connected thereto;
- a bump having an insulating layer formed on sidewalls thereof, the bump overlying the bond pads;
- and
- an anisotropic conductive film interposed between the semiconductor chip and the package substrate to electrically connect the connection pads and the bump.
2 more elements
Dependencies are inferred from the claim text.