Semiconductor device having multi-chip package

A semiconductor device comprising:

• a plurality of lead frames;
• a first semiconductor chip having a first surface on which a plurality of first bonding electrodes are formed and a second surface opposite to the first surface, the second surface of the first semiconductor chip is attached on the lead frame;
• a substrate having a third surface on which a plurality of conductive patterns are formed and a fourth surface opposite to the third surface, the fourth surface of the substrate is attached on the lead frame;
• a second semiconductor chip having a fifth surface on which a plurality of second bonding electrodes are formed and a sixth surface opposite to the fifth surface, the second bonding electrodes being in contact with the fourth surface of the substrate so that each of the second bonding electrodes are connected to one of the conductive patterns;
• a plurality of first wires electrically connecting one of the first bonding electrodes with one of the lead frames;
• a plurality of second wires electrically connecting one of the conductive patterns with one of the lead frames;
• and
• a molding resin covering the first and second chips, the substrate, the first and second wires and a part of the lead frames.

A semiconductor device comprising:

• a plurality of lead frames;
• a first semiconductor chip having an element formation surface and a back surface opposite to the element formation surface, the first semiconductor chip having a plurality of first bonding electrodes formed on the element formation surface, the back surface of the first semiconductor chip is attached on the lead frame;
• a substrate having a main surface and a reverse surface opposite to the main surface, the substrate having a plurality of conductive patterns formed on the main surface, the reverse surface of the substrate is attached on the lead frame;
• a second semiconductor chip having an element formation surface and a back surface opposite to the element formation surface, the second semiconductor chip having a plurality of second bonding electrodes formed on the element formation surface, the second bonding electrodes being in contact with the main surface of the substrate so that each of the second bonding electrodes are connected to one of the conductive patterns;
• a plurality of first wires electrically connecting one of the first bonding electrodes with one of the lead frames;
• a plurality of second wires electrically connecting one of the conductive patterns with one of the lead frames;
• and
• a molding resin covering the first and second chips, the substrate, the first and second wires and a part of the lead frames.