Solder ball attaching system and method
AssigneeSamsung Electronics Co., Ltd.
InventorsJu-Il Kang, Hee-Sang Yang
Life of this patent
Estimating the term…
Abstract
The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.
Claims26
A method for attaching solder balls of a ball grid array package, the method comprising:
- a solder ball seating step of unloading base frames attaching base tapes on which solder ball pads are provided, coating the solder ball pads with flux, transferring identified solder balls on positions of the corresponding solder ball pads respectively, transferring the base frame after confirming the position of the solder balls on the solder ball pads, and transferring an empty container, from which all base frames are unloaded, in a designated position;
- a solder ball reflow step of melting and cooling the solder balls seated on the solder ball pads and transferring the base frames after receiving the base frames from the solder ball seating step;
- a cleaning step of removing the flux covered on the solder ball pads and transferring the base frames after receiving the base frames from the solder ball reflow step;
- and
- a base frame storing step of determining quality of the base frames received from the cleaning step, sorting the base frames according to the quality and storing the base frames in the empty container transferred to the designated position.
A system for attaching solder balls, the system comprising:
- a base body;
- base frames unloader for unloading base frames from containers mounted on the base body to seat the solder balls on solder ball pads of the base frames;
- a solder ball seating device mounted on the base body, the solder ball seating device receiving the unloaded base frames from the base frame unloader, fixing in a designated position, coating with flux, seating the solder balls, sorting the base frames according to quality of solder ball seating and storing the base frames of good quality;
- a reflow device mounted on the base body, the reflow device loading the sorted and stored base frames and melting and cooling the solder balls;
- a cleaning device mounted on the base body, the cleaning device receiving the loaded base framed from the reflow device, cleaning the flux remaining on the solder ball pads with cleaning solution and drying the cleaning solution covered during cleaning step;
- and
- a base frame loader mounted on the base body, the base frame loader sorting the base frames according to attachment quality of solder ball attached on the solder ball pads of the base frames transferred from the cleaning device and storing the base frames of good quality.
Dependencies are inferred from the claim text.