Method of connecting circuit boards
AssigneeDenso Corporation
InventorsToshihiro Miyake, Yoshitaro Yazaki
Life of this patent
Estimating the term…
Abstract
The invention provides metal connecting composition for connecting metal to metal with removing oxide film on the mother metal surface. The metal connecting composition contains metal particles and hydrocarbon compound having C—H bonding dissociation energy of a value equal to or lower than 950 KJ/mol. When metal pieces between which the metal connecting composition is applied is heated, the hydrocarbon compound is dehydrogenated to form radical, and the radical reduces oxide film on the metal surface to be connected.
Claims10
A metal connecting composition comprising metal particles and a hydrocarbon compound having C—H bonding dissociation energy of a value equal to or lower than 950 KJ/mol.
A method for connecting circuit boards comprising the steps of:
- providing composition of metal particles and a hydrocarbon compound having C—H bonding dissociation energy of a value equal to or lower than 950 KJ/mol;
- applying said composition between a metal terminal of a first circuit board and a metal terminal of a second circuit board;
- and
- heating connection portions of both circuit boards to connect a metal terminal of the first circuit board and a metal terminal of the second circuit board with interposition of the composition therebetween.
Dependencies are inferred from the claim text.