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US 2003/0213772 A9Published application
Integrated semiconductor substrate bevel cleaning apparatus and method
OwnerYeuk-Fai Edwin Mok, Alexander Ko +2inventors
InventorsYeuk-Fai Edwin Mok, Alexander Ko, Bernardo Donoso, Joseph J. Stevens
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Abstract
An integrated semiconductor substrate bevel cleaning system that enables transfer of substrates through the bevel cleaner either with or without substrate processing within the bevel cleaner. The invention provides an integrated bevel cleaning apparatus comprising a transfer position, a rinsing position and an etching position.
Claims22
An integrated bevel cleaning (IBC) apparatus, comprising:
- a transfer position where a substrate is positioned for processing and where a substrate is positioned after processing;
- a rinse position where the substrate is rinsed;
- and
- an etch position where the substrate edge bead is removed;
- and
- an actuator for positioning the substrate in the transfer position, the rinse position and the etch position.
3 more elements
A method for etching electroplated material from a substrate within an integrated bevel cleaning (IBC) apparatus, comprising:
- introducing the substrate into a transfer position within the IBC apparatus;
- moving the substrate to a rinse position within the IBC apparatus;
- rinsing the substrate in the rinse position within the IBC apparatus;
- moving the substrate to an etch position within the IBC apparatus;
- and
- etching material from the substrate in the etch position within the IBC apparatus.
3 more elements
A system for processing substrates comprising:
- a loading station having at least one first chamber;
- a process region having at least one second chamber;
- an integrated bevel cleaning (IBC) apparatus comprising a transfer position through which a substrate can be passed from said load station to said process region without processing being performed in said IBC apparatus.
Dependencies are inferred from the claim text.