Method and apparatus for substrate polishing

Apparatus for processing a substrate comprising:

• a basin;
• a first electrode coupled to a bottom of the basin;
• a second electrode coupled to the bottom of the basin, the first and second electrodes adapted to be electrically biased relative to each other;
• a dielectric pad having a first side and a second side, the second side disposed on the bottom of the basin;
• a first aperture formed through the dielectric pad and having the first electrode extending partially therethrough;
• and
• a second aperture formed through the dielectric pad and having the second electrode extending partially therethrough.

Apparatus for processing a substrate comprising:

• a basin;
• a dielectric pad having a first side and a second side disposed on a bottom of the basin;
• a first electrochemical cell formed in the dielectric pad;
• and
• a second electrochemical cell formed in the dielectric pad and adapted to have a polarity opposite the first electrochemical cell.

Apparatus for processing a substrate comprising:

• a) a polishing pad assembly comprising:
• a dielectric layer having a substrate supporting surface;
• a plurality of conductive elements coupled to the dielectric layer and adapted to contact the substrate;
• a backing coupled to the dielectric layer;
• and
• an electrode coupled to the backing;
• b) a basin having the pad assembly disposed therein, the dielectric layer of the pad assembly facing an open end of the basin;
• and
• c) a polishing head disposed above the open end of the basin and adapted to place a substrate retained therein in contact with the pad assembly disposed in the basin.

Apparatus for processing a substrate comprising:

• a basin adapted to retain a substrate therein;
• a housing supported over the basin and having an open end facing the basin;
• a dielectric layer coupled to the open end of the housing;
• a backing coupled to the dielectric layer;
• and
• an electrode disposed in the housing and coupled to backing, the electrode, the backing and the dielectric layer forming a replaceable, unitary body.

Apparatus for polishing a substrate, comprising:

• a basin having sides and a bottom adapted to contain electrolyte during a polishing process;
• a dielectric pad disposed in the basin;
• at least a first aperture and a second aperture formed in a polishing surface of the dielectric pad;
• a first electrode disposed in the first aperture, the first electrode recessed from the polishing surface of the dielectric pad;
• and
• a second electrode disposed in the second aperture, the second electrode recessed from the polishing surface of the dielectric pad.

A method for electro-chemical processing a substrate, the method comprising:

• placing the substrate in contact with a surface of a dielectric pad having a first aperture and a second aperture formed in the surface;
• moving the substrate and the dielectric pad relative to each other;
• creating a first conductive path between an anode and the substrate through the first aperture;
• and
• creating a second conductive path between a cathode and the substrate through the second aperture.

A method for electro-chemical processing a substrate, the method comprising:

• placing the substrate in contact with conductive elements disposed on a first surface of a dielectric pad;
• moving the substrate and the dielectric pad relative to each other;
• creating a plurality of conductive paths between the substrate and a conductive layer coupled to a second surface of the dielectric pad;
• and
• applying an electrical bias between the substrate and the conductive layer.