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US 2003/0213616 A1Published application
Printed wiring board and electronic device using the same
AssigneeRenesas Technology Corp.
InventorsJunpei Kusukawa, Ryozo Takeuchi
Life of this patent
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AssigneeRenesas Technology Corp.
InventorsJunpei Kusukawa, Ryozo Takeuchi
Estimating the term…
The present invention provides a printed wiring board which has high insulation resistance between wirings and is unlikely to cause failures such as leakages or short circuits, attributable to ion migration even in high temperatures and highly humid environments. The printed wiring board has a circuit comprising a metal conductor on base metal layers created by forming an insulating resin layer 4 on at least one face of an insulating substrate 1 and forming the base metal layers 2 and 5 on the insulating resin layer. In the printed wiring board, at least a part of an upper face of the insulating resin layer existing in spaces 11 between the metal conductors is formed at a position lower than the interface between the base metal layer 5 and the insulating resin layer 4.
A printed wiring board comprising a metal conductor (wiring) created by forming a resist on at least one face of an insulating substrate and providing a metal on a portion other than the resist (by an additive process),
A printed wiring board comprising a metal conductor (wiring) created by forming a metal layer on at least one face of an insulating substrate and removing the metal layer except for the portion thereof that is to be the metal conductor (wiring) (by a subtractive process),
A printed wiring board comprising a metal conductor (wiring) obtained by forming a base metal layer on at least one face of an insulating substrate, forming a resist on the base metal layer, providing a metal on a portion other than the resist, removing the resist, and removing the base metal layer except for the portion thereof that is to be the metal conductor (wiring) (by a semi-additive process),
A printed wiring board comprising a metal conductor (wiring) created by forming an insulating resin layer on at least one face of an insulating substrate, forming a resist on the insulating resin layer, and providing a metal on a portion except for the resist (by an additive process),
A printed wiring board comprising a metal conductor (wiring) created by forming an insulating resin layer on at least one face of an insulating substrate, forming a metal layer on the insulating resin layer, and removing the metal layer except for the portion thereof that is to be the metal conductor (wiring) (by a subtractive process),
A printed wiring board comprising a metal conductor (wiring) created by forming an insulating resin layer on at least one surface of an insulating substrate, forming a base metal layer on the insulating resin layer, forming a resist on the base metal layer, providing a metal on a portion other than the resist, removing the resist, and removing the base metal layer except for the portion thereof that is to be the metal conductor (wiring) (by a semi-additive process),
A printed wiring board comprising a metal conductor (wiring) created by forming a resist on at least one face of an insulating substrate and providing a metal on a portion other than the resist (by an additive process),
A printed wiring board comprising a metal conductor (wiring) created by forming a base metal layer on at least one face of an insulating substrate, forming a resist on the base metal layer, providing a metal on a portion other than the resist, removing the resist, and removing the base metal layer except for the portion thereof that is to be the metal conductor (wiring) (by a semi-additive process),
A printed wiring board comprising a metal conductor (wiring) created by forming an insulating resin layer on at least one face of an insulating substrate, forming a resist on the insulating resin layer, and providing a metal on a portion other than the resist (by an additive process),
A printed wiring board comprising a metal conductor (wiring) created by forming an insulating resin layer on at least one face of an insulating substrate, forming a base metal layer on the insulating resin layer, forming a resist on the base metal layer, providing a metal on a portion other than the resist, removing the resist, and removing the base metal layer except for the portion thereof that is to be the metal conductor (wiring) (by a semi-additive process),
Dependencies are inferred from the claim text.