Wiring board, fabrication method of wiring board, and semiconductor device

A wiring board comprising:

• first and second conductor films facing each other;
• a first dielectric film provided between said first and second conductor films, and in contact with at least one of said first and second conductor films;
• and
• a second dielectric film provided between said first and second conductors, and attaining a solid state in a condition under which said first dielectric film has flowability,
• said first and second dielectric films meeting a relationship of 0<T1/(T1+T2)≦0.4, where T1 is a thickness of said first dielectric film and T2 is a thickness of said second dielectric film.

A semiconductor device comprising:

• first and second conductor films facing each other;
• a first dielectric film provided between said first and second conductor films, and forming contact with at least one of said first and second conductor films;
• a second dielectric film provided between said first and second conductor films, attaining a solid state in a condition under which said first dielectric film has flowability;
• and
• a semiconductor element connected to at least one of said first and second conductor films,
• said first and second dielectrics meeting a relationship of 0<T1/(T1+T2)≦0.4, where T1 is a thickness of said first dielectric film and T2 is a thickness of said second dielectric film.