Conductive layer pattern and method for forming the same, wiring board, electronic device, electronic appliances and noncontact card medium
AssigneeSeiko Epson Corporation
InventorsMasahiro Furusawa, Takashi Hashimoto
Life of this patent
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Abstract
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets or voids in the receiving layer and can be used, for example, to provide interlayer connections in laminated wiring boards. Preferably, the conductive material is provided by fine conductive particles, organometallic compounds or mixtures thereof.
Claims16
A conductive layer pattern comprising:
- a board having a surface;
- a receiving layer on the surface of the board, the receiving layer having fine voids therein;
- a plurality of segments selected from the group of conductive fine particles, organometallic compounds and mixtures thereof, the segments being bonded together on or in selected portions of the receiving layer to provide a conductor pattern thereon.
A method for forming a conductive layer pattern comprising the steps of:
- forming a receiving layer having fine voids therein on a surface of a wiring board;
- depositing a fluid containing fine conductive particles, organometallic compounds or mixtures thereof on the receiving layer;
- and
- forming a conductive pattern by contacting the conductive fine particles or organometallic compounds with each other on or in the receiving layer.
A wiring board comprising:
- a board having a surface;
- a receiving layer on the surface of the board, the receiving layer having fine voids therein;
- a plurality of segments selected from the group of conductive fine particles, organometallic compounds and mixtures thereof, the segments being bonded together on or in selected portions of the receiving layer to provide a plurality of wiring lines thereon
Dependencies are inferred from the claim text.