System and method for placing substrate contacts in a datapath stack in an integrated circuit design

A system for placing substrate contacts in a datapath stack comprising:

• means for establishing a floorplan for the datapath stack containing a plurality of datapath macros in a netlist;
• means for determining a placement of substrate contacts needed for a datapath macro in the datapath stack to minimize area used for the substrate contacts;
• and
• means for adding substrate contacts to the datapath stack.

A computer readable storage medium containing program code for placing substrate contacts in a datapath stack comprising:

• a first code segment configured to establish a floorplan for the datapath stack containing a plurality of datapath macros in a netlist;
• a second code segment configured to determine a placement of substrate contacts needed for a datapath macro in the datapath stack to minimize area used for the substrate contacts;
• and
• a third code segment configured to add substrate contacts to the datapath stack.

A contact placement system for placing substrate contacts in a datapath stack comprising:

• logic that establishes a floorplan for the datapath stack containing a plurality of datapath macros in a netlist;
• logic that determines a placement of substrate contacts needed for a datapath macro in the datapath stack to minimize area used for the substrate contacts;
• and
• logic that adds substrate contacts to the datapath stack.

A circuitry having substrate contacts constructed by the method comprising:

• establishing a floorplan for the datapath stack containing a plurality of datapath macros in a netlist;
• determining a placement of substrate contacts needed for a datapath macro in the datapath stack to minimize area used for the substrate contacts;
• and
• adding substrate contacts to the datapath stack.