Method for automatically controlling defect -specification in a semiconductor manufacturing process

A method for automatically controlling defect-specification in a semiconductor manufacturing process, the method comprising:

• (A) sampling at least one sample wafer from a batch of wafers;
• (B) detecting the physical property of each sample wafer by utilizing a module to detect a position, number, size, and intensity signals of defects on the sample wafer;
• (C) comparing the sample wafer with a normal wafer to preliminarily classify the sample wafer according to the discrepancies of signals and create a defect map by utilizing the module, the defect map comprising a spatial pattern of defects on the sample wafer;
• (D) analyzing the preliminarily classified defect map by utilizing a defect management system to detect the wafer having defects;
• (E) executing a spatial pattern recognition procedure by utilizing the defect management system to determine whether or not the defect map conforms to at least one of a plurality of specific patterns stored in the defect management system, each of the specific patterns corresponding to a defect type on the wafer, and each defect type at least corresponding to a related operator, a related equipment, and a related module;
• (F) searching the specific pattern conforming to the defect map to ensure the defect type on the sample wafer, and the related operator, the related equipment, and the related module according to the specific pattern;
• and
• (G) sending messages to an account of the related operator by the defect management system according to the defect type on the sample wafer so that the related equipment and the related module are tuned by the related operator according to the defect type on the wafer.