Adapter for surface mount devices to through hole applications

An electrical device adapter, comprising:

• a printed wiring board having a circuit layer and opposing primary and secondary sides,
• a plurality solder pads arranged on the primary side of the printed wiring board to interconnect with input/output signal pins of a surface mount technology (SMT) device, the solder pads electrically interconnected to the circuit layer of the printed wiring board;
• a plurality plated vias structured to accommodate one or more discrete electrical components and being electrically interconnected to the circuit layer of the board;
• a plurality plated through holes extending between the primary and secondary sides and being electrically interconnected to the circuit layer of the board, the plated through holes being positioned in a pattern structured to match plated through holes in a parent circuit board;
• and
• a plurality of elongated interconnect pins inserted in respective ones of the plurality plated through holes and extending a distance from the secondary side of the printed wiring board, the interconnect pins being electrically and mechanically interconnected to the respective plated through holes.

An electrical device adapter, comprising:

• a printed wiring board having at least a circuit layer and a ground layer between opposing primary and secondary sides,
• a plurality surface mount technology (SMT) device solder pads arranged on the primary side of the printed wiring board to accommodate a plurality of input/output signal pins of a SMT device;
• a plurality of plated vias electrically coupled between the solder pads and the circuit layer of the printed wiring board;
• a first plurality plated through holes extending between the primary and secondary sides and being electrically interconnected to the circuit layer of the printed wiring board, different pairs of the first plurality of plated through holes being structured to accommodate different discrete electrical components,
• a second plurality plated through holes extending between the primary and secondary sides and being electrically interconnected to the circuit layer of the printed wiring board, the second plurality of plated through holes being arranged in a pattern structured to imitate leads of a conventional TO-type device package;
• and
• an elongated input/output signal interconnect pin soldered in two or more of the second plurality plated through holes and extending a distance from the secondary side of the printed wiring board.