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US 2003/0211708 A1Published application
Method for producing semiconductor laser components
AssigneeOsram Opto Semiconductors GmbH & Co. OHG
InventorsBruno Acklin, Stefan Grotsch
Life of this patent
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Abstract
A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.
Claims29
A method for producing semiconductor laser components, which comprises:
- providing a cooling element having an electrically insulating carrier that is formed as a plate having a main surface which is covered by a metal coating;
- structuring the metal coating to form a plurality of chip mounting areas;
- fitting a plurality of semiconductor laser chips on the plurality of the chip mounting areas;
- and
- subdiving the cooling element into a plurality of semiconductor laser components that each include at least one of the plurality of the semiconductor laser chips and a part of the cooling element.
2 more elements
Dependencies are inferred from the claim text.