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US 2003/0211656 A1Published application
Method for fabricating multi-chip package semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorYasufumi Uchida
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a substrate (101); a first semiconductor chip (102) mounted on the substrate; and a first insulating layer (105) which is provided on the first semiconductor chip. The device further includes a metal layer (102) which is provided on the first insulating layer; a second insulating layer (117) which is provided on the metal layer; and a second semiconductor chip (104) which is provided on the second insulating layer.
Claims33
A semiconductor device, which comprises:
- a substrate;
- a first semiconductor chip which is mounted on the substrate;
- a first insulating layer which is provided on the first semiconductor chip;
- a metal layer which is provided on the first insulating layer;
- a second insulating layer which is provided on the metal layer;
- and
- a second semiconductor chip which is provided on the second insulating layer.
4 more elements
A semiconductor device, which comprises:
- a substrate;
- a first insulating layer which is provided on the substrate;
- a first semiconductor chip which is provided on the first insulating layer;
- a second insulating layer which is provided on the first semiconductor chip;
- a metal layer which is provided on the second insulating layer;
- a third insulating layer which is provided on the metal layer;
- and
- a second semiconductor chip which is provided on the third insulating layer.
5 more elements
A semiconductor device, which comprises:
- a substrate;
- a first insulating adhesive layer which is provided on the substrate;
- a first semiconductor chip which is adhered onto the substrate with the first insulating adhesive layer;
- a second insulating adhesive layer which is provided on the first semiconductor chip;
- a metal layer which is adhered onto the first semiconductor chip with the second insulating adhesive layer;
- a third insulating adhesive layer which is provided on the metal layer;
- and
- a second semiconductor chip which is adhered onto the meal layer with the third insulating adhesive layer, and is shaped to be smaller than the first semiconductor chip;
- metal wires which electrically connect the first and second semiconductor chip to the substrate;
- and
- a mold resin which covers the first and second semiconductor chips on the substrate to make a mold package of the semiconductor device, wherein
- the metal layer is shaped to have an area that corresponds to the bottom surface of the second semiconductor chip.
9 more elements
A semiconductor device, which comprises:
- a substrate which is shaped to have a cavity;
- a first semiconductor chip which is mounted in the cavity of the substrate;
- a first insulating layer which is provided on the first semiconductor chip;
- a metal layer which is provided on the first insulating layer;
- a second insulating layer which is provided on the metal layer;
- and
- a second semiconductor chip which is provided on the second insulating layer.
4 more elements
A semiconductor device, which comprises:
- a substrate which is shaped to have a cavity;
- metal terminals arranged in the cavity of the substrate;
- a first semiconductor chip which is provided in the cavity, and is provided at the bottom with metal bumps to be electrically connected to the metal terminals;
- a first insulating adhesive layer which is provided on the first semiconductor chip;
- a metal layer which is adhered onto the first semiconductor chip with the first insulating adhesive layer, and is shaped to have an enough area for covering up an upper opening of the cavity;
- a second insulating adhesive layer which is provided on the metal layer;
- a second semiconductor chip which is adhered on to the meal layer with the second insulating adhesive layer, and is shaped to be larger than the first semiconductor chip;
- an anisotropic conductive resin filling the cavity of the substrate, through which the metal bumps of the first semiconductor chip are electrically connected to the metal terminals in the cavity;
- metal wires which electrically connect the second semiconductor chip to the substrate;
- and
- a mold resin which covers at least the second semiconductor chip, metal layer and the metal wires to make a mold package of the semiconductor device.
8 more elements
A semiconductor device, which comprises:
- a substrate which is shaped to have a cavity;
- metal terminals arranged in the cavity of the substrate;
- a first semiconductor chip which is provided in the cavity, and is provided at the bottom with metal bumps to be electrically connected to the metal terminals;
- a first insulating adhesive layer which is provided on the first semiconductor chip;
- a metal layer which is adhered onto the first semiconductor chip with the first insulating adhesive layer;
- a second insulating adhesive layer which is provided on the metal layer;
- a second semiconductor chip which is adhered onto the metal layer with the second insulating adhesive layer, and is shaped not to be larger than the first semiconductor chip;
- an anisotropic conductive resin filling the cavity of the substrate, through which the metal bumps of the first semiconductor chip are electrically connected to the metal terminals in the cavity;
- metal wires which electrically connect the second semiconductor chip to the substrate;
- and
- a mold resin which covers at least the second semiconductor chip, metal layer and the metal wires to make a mold package of the semiconductor device.
8 more elements
A semiconductor device, which comprises:
- a substrate which is shaped to have a cavity having a tapered sidewall so that the opening area is larger than the bottom thereof;
- metal terminals arranged in the cavity of the substrate;
- a first semiconductor chip which is provided in the cavity, and is provided at the bottom with metal bumps to be electrically connected to the metal terminals;
- a first insulating adhesive layer which is provided on the first semiconductor chip;
- a metal layer which is adhered onto the first semiconductor chip with the first insulating adhesive layer;
- a second insulating adhesive layer which is provided on the metal layer;
- a second semiconductor chip which is adhered onto the meal layer with the second insulating adhesive layer, and is shaped not to be larger than the first semiconductor chip;
- metal wires which electrically connect the second semiconductor chip to the substrate;
- and
- a mold resin which fills up the cavity of the substrate and covers the first and second semiconductor chips to form a mold package of the semiconductor device, wherein
- the cavity is provided at the bottom with a depressed region so that the cavity is filled up with the mold resin easily.
8 more elements
A semiconductor device, which comprises:
- a substrate which is shaped to have a cavity having a tapered sidewall so that the opening area is larger than the bottom thereof;
- metal terminals arranged in the cavity of the substrate;
- a first semiconductor chip which is provided in the cavity, and is provided at the bottom with metal bumps to be electrically connected to the metal terminals;
- a first insulating adhesive layer which is provided on the first semiconductor chip;
- a metal layer which is adhered onto the first semiconductor chip with the first insulating adhesive layer to cover up the cavity of the substrate entirely;
- a second insulating adhesive layer which is provided on the metal layer;
- a second semiconductor chip which is adhered onto the metal layer with the second insulating adhesive layer, and is shaped not to be larger than the first semiconductor chip;
- metal wires which electrically connect the second semiconductor chip to the substrate;
- and
- a mold resin which fills up the cavity of the substrate and covers the first and second semiconductor chips to form a mold package of the semiconductor device, wherein
- the cavity is provided at the bottom with a depressed region so that the cavity is filled up with the mold resin easily, and
- the metal layer is provided with a plurality of openings so that the mold resin runs into the cavity easily through the openings.
9 more elements
A semiconductor device, which comprises:
- a substrate which is shaped to have a cavity;
- a first semiconductor chip which is mounted in the cavity of the substrate;
- and
- a second semiconductor chip which is provided on the first semiconductor chip.
1 more element
Dependencies are inferred from the claim text.