Method and apparatus for the multiplexed acquisition of a bar die from a wafer

A die handling apparatus for removing and holding a select group of die from a semiconductor wafer, each of said die having a first and a second planar surface parallel to a plane of the semiconductor wafer, comprising:

• a die acquisition member, located within an acquisition station, having a first gripper for securing the first planar surface of a die and removing said die from said wafer, said die acquisition member rotating so that the first and second planar surface of the die is oriented in a manner substantially perpendicular to the plane of the wafer;
• a die intermediary holding station having a first plurality of grippers for receiving and buffering a plurality of die received from the first gripper, such that the retention of said plurality of die is transferred from contact with the first planar surface by said first gripper to the second planar surface of said plurality of die by the first plurality of grippers;
• and
• a die conveyance station for receiving and transporting the plurality of die from the first plurality of grippers, where the plurality of die are received in parallel from the first plurality of grippers at said die intermediary holding station and transferred to a corresponding second plurality of grippers at said die conveyance station, such that the retention of the plurality of die is transferred from contact with the second planar surface by said first plurality of grippers to the first planar surface by the second plurality of grippers.