Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
AssigneeNitto Denko Corporation
InventorsHideyuki Usui, Satoshi Okuda, Minoru Nakao
Life of this patent
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Abstract
An epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μM or smaller is 80% by weight or more. Component (C) is uniformly dispersed in the composition without forming coarse agglomerates to secure low stress properties.
Claims10
An epoxy resin composition for semiconductor encapsulation, comprising:
- (A) an epoxy resin,
- (B) a phenolic resin, and
- (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more.
A semiconductor device comprising a semiconductor element encapsulated in an epoxy resin composition comprising:
- (A) an epoxy resin,
- (B) a phenolic resin, and
- (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more.
A process for producing an epoxy resin composition for semiconductor encapsulation, which comprises mixing at least (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particles of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more.
A semiconductor device comprising a semiconductor element encapsulated in an epoxy resin composition produced by a process comprising mixing at least (A) an epoxy resin, (B) a phenolic resin, and (C) butadiene rubber particles having an average particle size of secondary particle of 100 μm or smaller and having such a size distribution that the proportion of secondary particles having a particle size of 250 μm or smaller is 97% by weight or more, and the proportion of secondary particles having a particle size of 150 μm or smaller is 80% by weight or more.
Dependencies are inferred from the claim text.