IC card and method of manufacturing the same
AssigneeSeiko Epson Corporation
InventorsMasashi Kasuga, Wakao Miyazawa, Fukumi Tsuchihashi, Tomoyuki Kamakura
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Abstract
The invention provides an IC card in which it is difficult to separate IC chips from the IC card. In accordance with the invention, an IC card formed by laminating a plurality of substrates can include a sensor for identifying an authorized person, a signal processing circuit for processing the identification based on an output from the sensor and a card-shaped card medium containing the sensor and the signal processing circuit. At least the signal processing circuit can include a thin film circuit which is sufficiently thinner than the card medium and contains a material which is dissolvable equally to or more than the card medium.
Claims25
An IC card formed by laminating a plurality of substrates, comprising:
- a sensor that identifies an authorized person;
- a signal processing circuit that processes an identification based on an output from the sensor;
- and
- a card-shaped card medium containing the sensor and the signal processing circuit,
- at least the signal processing circuit including a thin film circuit which is sufficiently thinner than the card medium and contains a material which is dissolvable equally to or more than the card medium.
An IC card formed by laminating a plurality of substrates, comprising:
- a first substrate having a sensor device and a display device disposed on a first surface and a signal processing device comprising a thin film circuit and disposed on a second surface;
- a second substrate having a sensor window and a display device window at positions corresponding to the sensor device and the display device, respectively, having wiring films on a surface facing the first surface of the first substrate, and bonded to the first substrate;
- and
- a third substrate bonded to the other surface of the first substrate.
An IC card formed by bonding a plurality of substrates, comprising:
- a first substrate having a sensor device and a signal processing device disposed on a first surface;
- and
- a second substrate having a wiring film, a window, and a display device disposed on a surface facing the first surface of the first substrate, the wiring film forming wirings between or in the devices, the window exposing the sensor device, and the display device being disposed on correspondence to the signal processing device.
An IC card formed by bonding a plurality of substrates, comprising:
- terminals formed at an end of a substrate that connect internal circuits to the outside,
- the terminals protruding from any one substrate and being exposed on the front surface of the IC card and are fitted into fitting portions formed on other substrate.
A method of manufacturing an IC card, comprising:
- forming a thin-film-circuit-mounted substrate by transferring thin film circuits formed on a tentative substrate onto a thin film substrate for the IC card;
- and
- bonding protective substrates to both sides of the thin-film-circuit-mounted substrate, respectively.
A method of manufacturing an IC card, comprising:
- forming a thin-film-circuit-mounted substrate by transferring thin film circuits formed on a tentative substrate onto a thin film substrate for the IC card;
- and
- bonding a protective substrate to the thin-film-circuit-mounted substrate.
Dependencies are inferred from the claim text.