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US 2003/0209264 A1Published application
Polymer encapsulated micro-thermocouple
AssigneeRTD Company
InventorsAudeen Richetto, Pete Bernier
Life of this patent
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Abstract
A thermocouple produced by removing insulation from a distal end of each of at least first and second thermocouple conductors, forming a thermocouple junction at the distal ends of the at least first and second thermocouple conductors, placing the thermocouple junction into the heat shrinkable polymer material by sliding a second end of the tube of heat shrinkable polymer material over the thermocouple junction and sealing the thermocouple junction by heating and melting the polymer material.
Claims16
A thermocouple produced by the method comprising:
- removing insulation from a distal end of each of at least first and second thermocouple conductors;
- forming a thermocouple junction at the distal ends of the at least first and second thermocouple conductors;
- placing the thermocouple junction into a heat shrinkable polymer material by sliding an end of a tube of heat shrinkable polymer material over the thermocouple junction;
- and
- sealing the thermocouple junction by heating and melting the polymer material.
2 more elements
A thermocouple comprising:
- a thermocouple junction formed by soldering distal ends of first and second thermocouple conductors, wherein a length of the junction falls within the range of about 0.03 inches to 0.07 inches;
- and
- heat shrinkable polymer material melted to seal and electrically insulate the thermocouple junction within a reproducible confined shape, wherein electrical insulation to the junction is greater than 100 Megaohms when measured at 50 DC Volts, wherein a height of the confined shape falls within a range of about 0.003 to 0.010 inches, and wherein a width of the confined shape falls within a range of about 0.005 to 0.0110 inches.
Dependencies are inferred from the claim text.