Method for decreasing wafer scrap rate for a chemical treatment apparatus

A method for decreasing wafer scrap rate in the chemical treatment apparatus, comprising:

• providing a chemical treatment bath, wherein the chemical treatment bath has an inner and an outer bath, the outer being connected with a drain valve, and the chemical treatment bath has a chemical treatment liquid contained;
• performing a chemical treatment process by putting a wafer into the chemical treatment liquid;
• and
• when an alarm occur, opening the drain valve of the outer bath for draining the chemical treatment liquid out of the chemical treatment bath, and opening a supply valve of ultra-pure water for supplying the ultra-pure water into the inner bath of the chemical bath.

A method for decreasing wafer scrap rate in the chemical treatment apparatus, comprising:

• providing a chemical treatment bath, wherein the chemical treatment bath has an inner and an outer bath, and the chemical treatment bath has a chemical treatment liquid contained;
• performing a chemical treatment process by putting a wafer into the chemical treatment liquid;
• and
• when an alarm occurs, using a robot to take out the wafer from the chemical bath and to put the wafer into a rinsing bath having a rinsing liquid, wherein the alarm is resulted from a manufacturing parameter failing to meet a manufacturing standard, while a power supply and the robot are operated normally.