Wafer transfer system with temperature control apparatus

A semiconductor wafer transfer system comprising:

• a wafer blade and a thermoelectric device supported by the wafer blade, the thermoelectric device having an upper surface and a lower surface, and the thermoelectric device being constructed and arranged to pump heat from one of the surfaces to the other.

A semiconductor wafer transfer system comprising:

• a wafer blade and a thermoelectric device;
• the thermoelectric device comprising a plurality of alternating N-type and P-type semiconductor structures electrically connected in series and thermally connected in parallel, each of the semiconductor structures having a top surface and a bottom surface, and the thermoelectric device being constructed and arranged so that direct current flowing through the thermoelectric device will cause heat to be pumped from the top surface to the bottom surface, or from the bottom surface to the top surface of each of the semiconductor structures depending on the direction of electron flow through the thermoelectric device;
• the wafer blade comprising a base portion and a pair of spaced apart side rails extending therefrom, and wherein the thermoelectric device is supported by the side rails.