Optical device free from stress due to difference in thermal expansion coefficient between parts and process for fabrication thereof
AssigneesYamaha Corporation, Mitsubishi Denki Kabushiki Kaisha
InventorsYasuaki Takano, Naoshi Horiai
Life of this patent
Estimating the term…
Abstract
An optical device is broken down into an optical element made of optical crystal and a holder made of alloy approximated in thermal expansion coefficient to the optical crystal, and the optical element is soldered to or melt bonded to the holder with a piece of solder or glass; the joint area is spaced from the periphery of the optical crystal so that a buffer area, which is spaced from the periphery, is created between the periphery and the joint area; even if cracks and/ or scratches have been occurred in an end surface of the optical element, thermal stress is less influential in growing the scratches by virtue of the buffer area, and the optical device
Claims8
A process for fabricating an optical device, comprising the steps of:
- a) preparing an optical element having major surfaces and at least one end surface extending between peripheries of said major surfaces, a holder having a surface and a piece of fusible material;
- b) determining a joint area spaced from the periphery of at least one of said major surfaces and another joint area on said surface of said holder;
- c) aligning said joint area with said another joint area;
- and
- d) bonding said joint area to said another joint area by means of said piece of fusible material.
The process as set forth in claim 19, in which said optical element and said holder are put on a jig so that said jig makes said joint area and said another joint area aligned to one another in said step c).
The process as set forth in claim 19, in which said optical element has a metallization layer on said at least one of said major surfaces for offering said joint area.
The process asset forth in claim 21, in which said step a) includes the sub-steps of a-1) preparing a piece of optical crystal having a certain contour, a-2) forming a mask on said at least one of said major surfaces in such a manner that an area corresponding to at least said joint area is exposed to an opening formed in said mask, a-3) forming said metallization layer on said area, anda-4) removing said mask so that said metallization layer is left on said area.
The process as set forth in claim 22, in which said area is corresponding to both of said joint area and said buffer area so that said metallization layer offers both of said joint area and said buffer area.
The process as set forth in claim 19, in which said optical element and said holder have a metallization layer on said at least one of said major surfaces and a covering layer on a piece of alloy shaped into said holder so that said joint areas are defined in a surface portion of said metallization layer and a surface portion of said covering layer, respectively.
The process as set forth in claim 24, in which said optical element is prepared through the sub-steps of a-1) preparing a piece of optical crystal having a certain contour, a-2) forming a mask on said at least one major surfaces in such a manner that an area corresponding to at least said joint area is exposed to an opening formed in said mask, a-3) forming said metallization layer on said area, and a-4) removing said mask so that said metallization layer is left on said area, and said holder is prepared independently from said sub-steps a-1) to a-4) through the sub-steps of a-5) preparing a piece of alloy having another contour, and a-6) covering said piece of alloy with a layer through an electroplating.
The process as set forth in claim 25, in which said metallization layer and said layer have respective multi-layered structures, and the upper most layer of said metallization layer, said fusible material and the uppermost layer of said layer are made of Au, Au—Sn alloy and Au, respectively.
Dependencies are inferred from the claim text.