Radio frequency circuit module on multi-layer substrate
AssigneeNEC Corporation
InventorsNaoya Tamaki, Norio Masuda
Life of this patent
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Abstract
An object of the present invention is to provide a radio frequency integrated circuit module that is less susceptible to the electromagnetic influence and that is not degraded in electric connection. The radio frequency circuit module of the present invention including circuit elements mounted on a multi-layer circuit substrate having dielectric layers is characterized in that an exposed connection portion is provided by removing a part of the dielectric, and a strip line connected to said circuit elements and a co-axial line for transmitting a radio frequency signal from/to said strip line are connected together in a bottom portion of said exposed connection portion so as to be rectilinear in a three dimensional way.
Claims7
A radio frequency circuit module comprising:
- a multi-layer circuit substrate including dielectric layers;
- circuit elements mounted on said multi-layer circuit substrate;
- a strip line for connecting said circuit elements;
- and
- a co-axial line that is electrically connected with said strip line and that is substantially parallel with said strip line at an end portion of said multi-layer circuit substrate, said dielectric layers of said end portion being partially removed,
- wherein said co-axial line extends from said multi-layer circuit substrate substantially in parallel with said strip line.
Dependencies are inferred from the claim text.