Solder ball landpad design to improve laminate performance
AssigneeMicron Technology, Inc.
InventorsBrad D. Rumsey, Patrick W. Tandy, Willam J. Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
Life of this patent
Estimating the term…
Abstract
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
Claims69
A system comprising:
- a processor;
- and
- an integrated circuit package operatively coupled to the processor, the integrated circuit package comprising an integrated circuit die coupled to a substrate, the substrate comprising a first surface and a second surface, the second surface having a plurality of pads, each pad having one or more conductive traces extending on the second surface therefrom and configured to increase the shear strength of the pad as compared to the pad alone.
An integrated circuit package comprising:
- an integrated circuit die;
- and
- a substrate coupled to the integrated circuit die and comprising a first surface and a second surface, the second surface having a plurality of pads, each pad having one or more conductive traces on the second surface extending therefrom and configured to increase the shear strength of the pad as compared to the pad alone.
A substrate comprising a first surface and a second surface, the second surface having a plurality of pads, each pad having one or more conductive traces on the second surface extending therefrom and configured to increase the shear strength of the pad as compared to the pad alone.
A method of building an integrated circuit package comprising the acts of:
- (a) providing a substrate having a first surface and a second surface, the second surface having a plurality of pads, each pad having one or more conductive traces on the second surface extending therefrom and configured to increase the shear strength of the pad as compared to the pad alone;
- and
- (b) disposing an integrated circuit die onto the substrate.
A system comprising:
- a processor;
- and
- an integrated circuit package operatively coupled to the processor, the integrated circuit package comprising an integrated circuit die coupled to a substrate, each substrate comprising a first surface and a second surface, the second surface having an array of landpads, the array comprising four corner landpads, each of the four corner landpads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad.
An integrated circuit package comprising:
- an integrated circuit die;
- and
- a substrate coupled to the integrated circuit die and comprising a first surface and a second surface, the second surface having an array of landpads, the array comprising four corner landpads, each of the four corner landpads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad.
A substrate comprising a first surface and a second surface, the second surface having an array of landpads, the array comprising four corner landpads, each of the four corner landpads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad.
A substrate comprising a first surface and a second surface, the second surface having an array of landpads and four out-rigger pads, each of the out-rigger pads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad.
A method of manufacturing an integrated circuit package comprising the acts of:
- (a) manufacturing a plurality of BGA substrates comprising a plurality of landpads and a plurality of solderballs;
- (b) testing the substrates for failure mechanisms associated with a dislodging of the soldeballs;
- and
- (c) re-designing the substrates such that the landpads exhibiting the failure mechanisms are configured to increase the shear strength of the landpad.
A method of building an integrated circuit package comprising the acts of:
- (a) providing a substrate comprising a first surface and a second surface, the second surface having an array of landpads, the array comprising four corner landpads, each of the four corner landpads having one or more conductive traces extending planarly therefrom and configured to increase the shear strength of the pad;
- and
- (b) disposing an integrated circuit die onto the substrate.
Dependencies are inferred from the claim text.