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AssigneeSilicon Pipe, Inc.
InventorsPara Kanagasabai Segaram, Joseph Fjelstad, Belgacem Haba
Estimating the term…
In a semiconductor device having a semiconductor die without an ESD circuit and a separate ESD circuit and an external lead, the external lead is first bonded to the separate ESD circuit. Thereafter, the separate ESD circuit is bonded to the semiconductor die. As a result, in the process of bonding the semiconductor die, any ESD disturbance is absorbed by the ESD circuit. In addition, a semiconductor device such as a DDR DRAM memory device, has a chip carrier with a first surface having a plurality of leads and a second surface opposite to it with an aperture between them. A semiconductor die with a mounting surface and a bonding pad faces the second surface with the bonding pad in the aperture. An ESD circuit is mounted on the mounting surface in the aperture. A first electrical connector connects one of a plurality of leads to the ESD circuit and a second electrical connector connects the ESD circuit to the bonding pad.
A method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead wherein said method comprising:
A semiconductor device comprising:
A method of assembling a semiconductor device, said device including a semiconductor die having an integrated circuit with a plurality of rows of mounting pads connecting to said integrated circuit, on a mounting surface, said method comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.