Electrochemical/ mechanical polishing

A method comprising:

• providing a positive electric potential to an electrically conductive layer of a substrate;
• providing a negative electric potential to a linear nozzle plate;
• directing a jet of electrolyte solution from the linear nozzle plate to the electrically conductive layer of the substrate;
• providing a pad on the linear nozzle plate to disturb an electrolyte/substrate boundary layer;
• and
• scanning the linear nozzle plate along the surface of the electrically conductive layer of the substrate to uniformly electrochemically/mechanically polish the electrically conductive layer.

A method comprising:

• forming a dielectric layer on a substrate;
• patterning and etching the dielectric layer to form trenches;
• covering the dielectric layer with an electrically conductive layer;
• electrochemically/mechanically polishing the surface of the substrate, said electrochemically/mechanically polishing comprising:
• directing a jet of electrolyte solution from the linear nozzle plate to the electrically conductive layer of the substrate;
• providing a pad on the linear nozzle plate to disturb an electrolyte/substrate boundary layer;
• and
• scanning the linear nozzle plate along the surface of the electrically conductive layer to uniformly electrochemically/mechanically polish the electrically conductive layer.