Object plating method and system

A method of plating objects, the method comprising:

• adding plating substances to a plating cell;
• placing objects in the plating cell;
• plating the objects in the plating cell, wherein the amount of at least one component of the plating substances is reduced during the plating of the objects;
• removing the plated objects from the plating cell;
• draining used plating substances from the plating cell;
• monitoring at least one aspect associated with the plating of the objects, the aspect being related to the reduction in amount of the at least one component of the plating substances during the plating;
• and
• adjusting, based on said at least one monitored aspect, at least one of
• the flow rate of the plating substances added to the plating cell, and
• the flow rate of the used plating substances drained from the plating cell, to substantially maintain a concentration of the at least one component in the plating cell above a predetermined level.

A method of plating objects, the method comprising:

• adding plating substances to a plating cell;
• placing objects in the plating cell;
• plating the objects in the plating cell, wherein at least one byproduct of at least one of the plating substances is created during the plating;
• removing the plated objects from the plating cell;
• draining used plating substances from the plating cell, the used plating substances including the at least one byproduct;
• purifying the used plating substances to remove at least some of the at least one byproduct and thereby create purified plating substances;
• combining at least one component with the purified plating substances to create a mixture of plating substances;
• and
• passing the mixture of plating substances into the plating cell to thereby reuse the purified plating substances.

A system for use with a plating cell configured to plate objects, the plating cell being associated with means for adding plating substances to the plating cell, and means for draining used plating substances from the plating cell, the used plating substances including at least one byproduct of at least one of the plating substances, the byproduct being created during plating of the objects in the plating cell, the system comprising:

• at least one monitor configured to monitor at least one aspect associated with the plating of the objects, the aspect being related to the creation of the at least one byproduct;
• and
• a controller in electrical communication with the monitor, the controller being configured to control at least one of the adding means and the draining means, based on said at least one monitored aspect, to adjust at least one of
• the flow rate of the plating substances added to the plating cell, and
• the flow rate of the used plating substances drained from the plating cell, to substantially maintain a concentration of the at least one byproduct in the plating cell below a predetermined level.

A system for use with a plating cell configured to plate objects, the plating cell being associated with means for adding plating substances to the plating cell, the amount of at least one component of the plating substances being reduced during plating of objects in the plating cell, and means for draining used plating substances from the plating cell, the system comprising:

• at least one monitor configured to monitor at least one aspect associated with the plating of the objects, the aspect being related to the reduction in amount of the at least one component of the plating substances during the plating;
• and
• a controller in electrical communication with the monitor, the controller being configured to control at least one of the adding means and the draining means, based on said at least one monitored aspect, to adjust at least one of
• the flow rate of the plating substances added to the plating cell, and
• the flow rate of the used plating substances drained from the plating cell, to substantially maintain a concentration of the at least one component in the plating cell above a predetermined level.

A controller for use in a plating system wherein plating substances are added to a plating cell, objects are plated in the plating cell, at least one byproduct is created during the plating, used plating substances including the at least one byproduct are drained from the plating cell, and a purifier purifies the used plating substances to remove at least some of at least one byproduct created during plating of the objects in the plating cell, the controller comprising a configuration wherein the following equation is satisfied:

• 5 C b , t2 = C b , t0 + ( t2 - t1 ) V × ( m b - η b · d ⁢ ⁢ V p · C b , 11 )
• wherein
• Cb, t2=byproduct concentration at time t2,
• Cb, t1=byproduct concentration at time t1,
• Cb, t0=initial plating solution byproduct concentration,
• V=volume of plating substances in at least one of the plating cell and a storage tank associated with the plating cell,
• mb=mass rate of byproduct build up,
• dVp=liquid flow rate through the purifier, and
• ηb=byproduct removal efficiency of the purifier.

A method of plating objects, the method comprising:

• adding plating substances to a plating cell;
• placing objects in the plating cell;
• plating the objects in the plating cell, wherein at least one byproduct of at least one of the plating substances is created during the plating;
• removing the plated objects from the plating cell;
• draining used plating substances from the plating cell, the used plating substances including the at least one byproduct;
• and
• purifying the used plating substances in a purifier to remove at least some of the at least one byproduct and thereby create purified plating substances,
• wherein the following equation is satisfied:
• 6 C b , t2 = C b , t0 + ( t2 - t1 ) V × ( m b - η b · d ⁢ ⁢ V p · C b , 11 )
• wherein
• Cb, t2=byproduct concentration at time t2,
• Cb, t1=byproduct concentration at time t1,
• Cb, t0=initial plating solution byproduct concentration,
• V=volume of plating substances in at least one of the plating cell and a storage tank associated with the plating cell,
• mb=mass rate of byproduct build up,
• dVp=liquid flow rate through the purifier, and
• ηb=byproduct removal efficiency of the purifier.

A controller for use in a plating system wherein plating substances are added to a plating cell, objects are plated in the plating cell, at least one byproduct is created during the plating, used plating substances including the at least one byproduct are drained from the plating cell, a purifier purifies the used plating substances to remove at least some of at least one byproduct created during plating of the objects in the plating cell, at least one component is combined with the purified plating substance to create a mixture of plating substances, and the mixture of plating substances is pass into the plating cell, the controller comprising a configuration wherein the following equation is satisfied:

• 7 C c , t2 = C c , t0 + ( t2 - t1 ) V × ( V c · q · d ⁢ ⁢ t ( t2 - t1 ) - m c - h c · d ⁢ ⁢ V p · C c , t1 )
• wherein
• Cc, t2=component concentration at time t2,
• Cc, t1=component concentration at time t1,
• CC, t0=initial plating solution component concentration,
• Vc=flow rate of component introduction,
• q=component density,
• dt=time interval of component introduction,
• mc=mass rate of component consumption during the plating, and
• hc=component removal efficiency of the purifier.

A method of plating objects, the method comprising:

• adding plating substances to a plating cell;
• placing objects in the plating cell;
• plating the objects in the plating cell, wherein at least one byproduct of at least one of the plating substances is created during the plating;
• removing the plated objects from the plating cell;
• draining used plating substances from the plating cell, the used plating substances including the at least one byproduct;
• and
• purifying the used plating substances in a purifier to remove at least some of the at least one byproduct and thereby create purified plating substances,
• combining at least one component with the purified plating substances to create a mixture of plating substances;
• and
• passing the mixture of plating substances into the plating cell,
• wherein the following equation is satisfied:
• 8 C c , t2 = C c , t0 + ( t2 - t1 ) V × ( V c · q · d ⁢ ⁢ t ( t2 - t1 ) - m c - h c · d ⁢ ⁢ V p · C c , t1 )
• wherein
• Cc, t2=component concentration at time t2,
• Cc, t1=component concentration at time t1,
• Cc, t0=initial plating solution component concentration,
• Vc=flow rate of component introduction,
• q=component density,
• dt=time interval of component introduction,
• mc=mass rate of component consumption during the plating, and
• hc=component removal efficiency of the purifier.