Method for improving an electrodeposition process through use of a multi-electrode assembly
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Wei Chou, Ming-Hsing Tsai
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShih-Wei Chou, Ming-Hsing Tsai
Estimating the term…
An electrode assembly arrangement for improving an electrodeposition process and method for using the same the electrode assembly arrangement including a first electrode assembly and a second electrode assembly positioned to carry a metal containing electrolyte from the first electrode assembly to the second electrode assembly for deposition of the metal upon applying an electrical potential therebetween; at least one additional electrode assembly including a means for selectively applying an electrical potential thereto the at least one additional electrode assembly positioned to attract an electrolyte flow upon applying an electrical potential between the at least one additional electrode assembly and the second electrode assembly.
A method for improving an electrodeposited film uniformity during an electrodeposition and electropolishing process comprising the steps of:
An electrode assembly arrangement for improving an electrodeposition process comprising:
Dependencies are inferred from the claim text.