Electro deposition chemistry
AssigneeApplied Materials, Inc.
InventorsUziel Landau, John J. D'Urso, David B. Rear
Life of this patent
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Abstract
The present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.
Claims26
A method for forming a metal film on a semiconductor substrate, comprising:
- electrodepositing a metal on the semiconductor substrate using a plating solution containing up to about 0.4M of supporting electrolyte.
A method for forming a metal film, comprising:
- electrodepositing copper on a semiconductor substrate using a plating solution comprising greater than about 0.8M copper and up to about 0.4M of supporting electrolyte.
A method of forming a copper film, comprising:
- electrodepositing copper on a semiconductor substrate using a plating solution comprising a conducting salt and up to about 0.4M of acid.
A method for forming a metal film on a substrate, comprising;
- electrodepositing a metal onto the substrate using a plating solution that contains metal ions and up to about 0.4M of a supporting electrolyte.
Dependencies are inferred from the claim text.