US 2003/0205461 A1 · Removable modular cell for electro-chemical plating

Abstract

The present invention relates to a method and apparatus for depositing metal on a substrate. More particularly, one embodiment of the metal deposition cell comprising a cell base, an anode, and a cell top. The cell base at least partially defines an interior recess. The anode mounted within the interior recess to the cell base. The cell top is removably mounted to the cell base. In one embodiment, a method of removing a modular metal deposition cell from a deposition cell mount is provided. The modular metal deposition cell comprises a cell top and a cell bottom. The method comprises unfastening a fastener that secures the cell top to the cell bottom, and also fastens the cell top and the cell bottom to the deposition cell mount. The cell top or the cell bottom is then removed from the deposition cell mount.

Claims26

Dependent claims

An electrochemical plating cell, comprising:

a lower cell body defining a first fluid containing volume, the first fluid containing volume having a base and upstanding wall that defines an opening;
an upper cell body removably secured to the lower cell body over the opening and defining a second fluid containing volume;
and
an anode positioned in the first fluid containing volume.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

10/429,684Filed 5 May 2003

Priority

15 Sep 2000

Published

6 Nov 2003

Term ends

Not estimatedThe source records don’t support an estimate.

Classification17 codes

H10P 72/0454
Characterised by the layout of the process chambers: surrounding a central transfer chamber
C25D 7/123
Semiconductors: semiconductors first coated with a seed layer or a conductive layer
C25D 17/001
Constructional parts, or assemblies thereof, of cells for electrolytic coating: apparatus specially adapted for electrolytic coating of wafers,…
C25D 17/004
Constructional parts, or assemblies thereof, of cells for electrolytic coating: sealing devices

Removable modular cell for electro-chemical plating

Life of this patent

Removable modular cell for electro-chemical plating

Life of this patent

Abstract

Claims26