Method and apparatus for fabricating a device, and the device and an electronic equipment
AssigneeSeiko Epson Corporation
InventorsHironori Hasei, Toshimitsu Hirai
Life of this patent
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Abstract
The invention provides an apparatus for fabricating a device, in which a high operation efficiency is maintained in a drying treatment for a multilayer-interconnection device. The device can also be fabricated inexpensively. An apparatus for fabricating a device has an inkjet unit that can dispose a liquid material on a substrate, and a preparatory dryer to blow a gas heated at a predetermined temperature to the substrate.
Claims13
A method for fabricating a device, comprising:
- disposing a liquid material on a substrate;
- preparatorily drying the liquid material by blowing a gas heated at a predetermined temperature to the substrate on which the liquid material was disposed;
- and
- stacking multiple material layers on the substrate.
A method for fabricating a device, comprising:
- disposing a liquid material on a substrate;
- preparatorily drying the liquid material by relatively moving a gas above a surface of the substrate on which the liquid material is disposed;
- and
- stacking multiple material layers on the substrate.
An apparatus for fabricating a device, comprising:
- a deposition unit capable of supplying liquid material on a substrate;
- and
- a preparatory dryer to blow gas heated at a predetermined temperature to the substrate.
An apparatus for fabricating the device, comprising:
- a deposition unit capable of supplying liquid material on a substrate;
- and
- a preparatory dryer to move a gas above a surface of the substrate relatively to the substrate.
Dependencies are inferred from the claim text.