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US 2003/0202306 A1Published application
Heat sink for semiconductor die employing phase change cooling
AssigneeInternational Rectifier Corporation
InventorAjit Dubhashi
Life of this patent
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Abstract
An electrical assembly, including an electrical device; and at least one self-contained phase change package in thermal contact with the electrical device, the self-contained phase change package including an enclosure and a phase change material arranged within the enclosure; wherein the phase change material is suitably selected to change phase during an overload condition.
Claims16
An electrical assembly, comprising:
- an electrical device;
- and
- at least one self-contained phase change package in thermal contact with the electrical device, the self-contained phase change package including an enclosure and a phase change material arranged within the enclosure;
- wherein the phase change material is suitably selected to change phase during an overload condition.
1 more element
A method of constructing an electrical assembly, comprising:
- providing an electrical device;
- and
- arranging at least one self-contained phase change package in thermal contact with the electrical device, the self-contained phase change package including an enclosure and a phase change material arranged within the enclosure;
- wherein the phase change material is suitably selected to change phase during an overload condition.
1 more element
A self-contained phase change package, comprising:
- an enclosure configured to couple to an electrical device;
- and
- a phase change material arranged within the enclosure;
- wherein the phase change material is suitably selected to change phase during an overload condition.
1 more element
Dependencies are inferred from the claim text.