Semiconductor wafer inspection apparatus

Abstract

A semiconductor wafer inspection apparatus of the present invention is provided with the following a rotatable table on which a semiconductor wafer is sucked and held, an illuminating device which illuminates at least an edge portion of the semiconductor wafer held on the rotatable table, an imaging device which captures an image of the edge portion of the semiconductor wafer when the edge portion is illuminated by the illuminating device, an image processing device which detects at least an edge cut amount or a crack by acquiring the image of the edge portion which is captured by the imaging device, and a display section which displays an image of the edge portion subjected to image processing by the image processing device.

Dependencies are inferred from the claim text.