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US 2003/0201856 A1Published application
Active alignment as an integral part of optical package design
AssigneeAnalog Devices, Inc.
InventorKieran Patrick Harney
Life of this patent
Estimating the term…
Abstract
A microstructure package and a method of assembling such a package are described. A package base provides an outer body of the package and has an internal cavity. A device die is located within the cavity, and a flexible die paddle connects the base and the die. The paddle is immovably fixed to hold the die in a highly precise position relative to the base.
Claims26
A microstructure package comprising:
- a package base providing an outer body of the package and having an internal cavity;
- a device die located within the cavity;
- and
- a flexible die paddle connecting the base and the die,
- wherein the paddle is immovably fixed such that the die has a highly precise position relative to the base.
2 more elements
A method of assembling a microstructure package comprising:
- providing an outer body base of the package which has an internal cavity;
- attaching a device die to a flexible die paddle located within the cavity so as to connect the base and the die,
- immovably fixing the paddle so that the die has a highly precise position relative to the base.
Dependencies are inferred from the claim text.