Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient
AssigneeAxcelis Technologies, Inc.
InventorBryan C. Lagos
Life of this patent
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Abstract
The invention provides a system and apparatus by which a workpiece pad is supplied to support workpieces being implanted in a rotating or spinning batch implanter process disk. The workpiece pad provides reduced surface adhesion forces and sufficient heat transfer from the workpieces to the process disk, and furthermore reduces particle generation and contamination of the workpiece from the workpiece pad. The workpiece pad furthermore comprises an ordered array of micro-structures. In addition, the invention includes a method of forming a workpiece pad comprising an ordered array of micro-structures.
Claims33
An ion implantation system, comprising:
- a workpiece pad having a surface whereon a workpiece resides, wherein at least a portion of the workpiece pad surface comprises an ordered array of micro-structures;
- a pedestal whereon the workpiece pad resides;
- a process disk mounted on a shaft for rotation about an axis, wherein the process disk is adapted to support the pedestal thereon;
- and
- an ion source adapted to provide ions to the workpiece residing on the workpiece pad.
A pedestal for supporting a workpiece in a batch ion implantation system, comprising a substantially resilient workpiece pad adhered to the pedestal, the workpiece pad having a surface whereon a workpiece resides, wherein the surface of the workpiece pad comprises and ordered array of micro-structures.
A method of forming a resilient workpiece support for supporting at least one workpiece in a batch ion implantation system, comprising:
- placing a substantially flexible mold comprising a first surface and a second surface on a substantially rigid plate, wherein the first surface of the mold comprises an ordered array of inverted micro-structures, and wherein the second surface faces the rigid plate;
- applying a liquified workpiece pad material onto the first surface of the mold, wherein the liquified workpiece pad material substantially covers the ordered array of inverted micro-structures, and wherein the liquified workpiece pad material is adapted to substantially permit bonding to a substantially rigid pedestal and substantially prevent bonding to the mold;
- placing the pedestal onto the liquified workpiece pad material, wherein the pedestal contacts the liquified workpiece pad material at a plurality of locations;
- curing the liquified workpiece pad material, thereby forming a cured resilient workpiece pad material substantially bonded to the pedestal;
- removing the rigid plate from the second surface of the mold;
- removing the mold from the cured resilient workpiece pad material, thus forming a resilient workpiece support comprising a resilient workpiece pad, wherein the workpiece pad further comprises a plurality of resilient micro-structures.
A method of forming a resilient workpiece support for supporting at least one workpiece in a batch ion implantation system, comprising:
- placing a substantially flexible mold comprising a first surface and a second surface on a substantially rigid plate, wherein the first surface of the mold comprises an ordered array of inverted micro-structures, and wherein the second surface faces the rigid plate;
- applying a liquified workpiece pad material onto a substantially rigid pedestal, wherein the pedestal contacts the liquified workpiece pad material at a plurality of locations, and wherein the liquified workpiece pad material is adapted to substantially permit bonding to the pedestal and substantially prevent bonding to the mold;
- placing the pedestal and the applied liquified workpiece pad material onto the first surface of the mold, wherein the liquified workpiece pad material substantially covers the ordered array of inverted micro-structures;
- curing the liquified workpiece pad material, thereby forming a cured resilient workpiece pad material substantially bonded to the pedestal;
- removing the rigid plate from the second surface of the mold;
- removing the mold from the cured resilient workpiece pad material, thus forming a resilient workpiece support comprising a resilient workpiece pad, wherein the workpiece pad further comprises a plurality of resilient micro-structures.
Dependencies are inferred from the claim text.